. : http://www.issp.ac.ru/conf/Microtechnologies-New-Millennium-2009.pdf
: Fri Oct 24 13:48:24 2008
: Tue Oct 2 00:51:55 2012
: IBM-866
Call for Papers

Conferences: 46 May 2009 Maritim Hotel Dresden, Germany

PRESENT YOUR RESEARCH -- PUBLISH IN THE WORLD BOD Y OF SCIENTIFIC LITERATURE

Smart Sensors, Actuators, and MEMS VLSI Circuits and Systems Nanotechnology Bioengineered and Bioinspired Systems Photonic Materials, Devices, and Applications


Call for Papers

Conferences: 46 May 2009 Maritim Hotel Dresden, Germany

PRESENT YOUR RESEARCH -- PUBLISH IN THE WORLD BODY OF SCIENTIFIC LITERATURE

Participate in a cutting-edge regional forum focused on the latest advances in microtechnologies.
Share your research
Present your latest developments in the technologies that are shaping the future. Conferences will cover a range of topics from bioengineered and bioinspired systems to developments in photonic materials, devices, and applications.

Collaborate with your colleagues
Take advantage of the synergies being created by engineers, scientists, researchers, and managers working on various aspects of microtechnologies. Meet with your colleagues in Dresden, Germany, to help shape the future of these vital technologies.

Publish your research
Within weeks of your presentation, your work will be published in the SPIE Digital Library and become part of the scientific literature of the world. U.S. Patent literature currently cites 34,342 SPIE publications, with 161 universities and 2,785 nonacademic organizations from 43 different countries citing SPIE papers. Make your mark--join the ranks of the most innovative minds in optics.

Submit your abstract today!

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Contents

Contents
Smart Sensors, Actuators and MEMS (Schmid) . . . . . . . . . . . . . 6 VLSI Circuits and Systems (Riesgo) . . . . . . . . . . . . 7
Sponsored by

Nanotechnology (Wixforth). . . . . . . . 8 Bioengineered and Bioinspired Systems (Rodrguez-Vzquez) . . . . . . 8
Cooperating Organisations

Photonic Materials, Devices, and Applications (Serpenguzel). . . . . . 9
General Information . . . . . . . . . . . . . . . 10 Abstract Submission Information . . . . . . . . . . . . . . . . . . . . . 11

Critical Dates
Abstract Due Date: 31 October 2008 Proceedings Manuscript Due Date: 3 April 2009
Please note: Submissions imply the intent of at least one author to register, attend the symposium, present the paper as scheduled (either orally or in poster format), and submit a full-length manuscript for publication in the Proceedings of SPIE. Abstract Text: Please submit a text-only abstract with approximately 500 words (one page). This abstract will be reviewed by the conference organizers and may be included in the abstract digest which will be available onsite.

Left cover image courtesy of Z. L. Wang and X.D. Wang, Georgia Institute of Technology.

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Call for Papers

Your input is crucial!
Take this opportunity to submit your latest research work to the 4th SPIE Europe Microtechnologies for the New Millennium. Meet colleagues from academia and industrial research groups in the heart of Europe, to share your latest ideas in technological fields, really essential for shaping the new millennium. Feel the inspiring atmosphere of Dresden at the river Elbe, being a cultural, scientific and industrial center last but not least for micro-, bio- and nanotechnology. Five exciting conferences in the field of microtechnologies are linked together, namely, Smart Sensors, Actuators and MEMS; VLSI Circuits and Systems; Nanotechnology; Bioengineered and Bioinspired Systems; and Photonic Materials, Devices and Applications. Take advantage of the synergies being created by engineers, scientists, researchers, and managers working on various aspects of microtechnologies. You will have a unique opportunity to hear about the latest advances in autonomous sensors, low-power high-data-rate communications, molecular electronics, micro-manipulation and implantable bio-chips, nanophotonic materials, nanoelectromechanical systems, and many other cutting-edge R&T results. Exchange new ideas, address your shared concerns, and get access to information not yet published in these topical areas. Submit your abstract by 31 October 2008. If accepted, your paper will be permanently archived in the SPIE Digital Library, where it will be made available to others in the international scientific community who seek to learn, make discoveries, and innovate. We welcome you to feel at home in Germany and to meet colleagues and friends in a most stimulating scientific symposium.

2009 Symposium Chair Thomas Becker, EADS Deutschland GmbH (Germany)

2009 Symposium Co-chairs Jos L?pez Feliciano, Univ. de Las Palmas de Gran Canaria (Spain)

Gerhard Kr?tz, University of Applied Sciences in Kempten (Germany)

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Technical Committee Gonal Badenes, Institut de Cincies Fot?niques, Spain Carles Can, Ctr. Nacional de Microelectr?nica, Spain Ricardo A. Carmona, Instituto de Microelectr?nica de Sevilla-CNM-CSIC, Spain Gustavo Lin-Cembrano, Instituto de Microelectr?nica de Sevilla-CNM-CSIC, Spain Eduardo de la Torre, Univ. Politcnica de Madrid, Spain Leandro Soares Indrusiak, Technische Univ. Darmstadt (Germany) Gerhard Kr?tz, University of Applied Sciences in Kempten, Germany Jos L?pez Feliciano, Univ. de Las Palmas de Gran Canaria, Spain Axel Lorke, Univ. Duisburg-Essen, Germany Teresa Riesgo, Univ. Politcnica de Madrid, Spain Giancarlo C. Righini, CNR, Italy ngel B. Rodrguez-Vzquez, Instituto de Microelectr?nica de Sevilla-CNM-CSIC, Spain Ali Serpenguzel, Ko Univ., Turkey Ulrich Schmid, Saarland Univ.,Germany Herbert R. Shea, cole Polytechnique Fdrale de Lausanne, Switzerland Friedrich C. Simmel, Technische Univ. M?nchen (Germany) Achim Wixforth, Univ. of Augsburg, Germany

Critical Dates
Abstract Due Date: 31 October 2008 Proceedings Manuscript Due Date: 3 April 2009
Please note: Submissions imply the intent of at least one author to register, attend the symposium, present the paper as scheduled (either orally or in poster format), and submit a full-length manuscript for publication in the Proceedings of SPIE. Abstract Text: Please submit a text-only abstract with approximately 500 words (one page). This abstract will be reviewed by the conference organizers and may be included in the abstract digest which will be available onsite.

Submit your abstract today!

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Microtechnologies
Smart Sensors, Actuators and MEMS (EMT101)
Conference Chair: Ulrich Schmid, Saarland Univ. (Germany) Cochairs: Carles Can, Ctr. Nacional de Microelectr?nica (Spain); Herbert R. Shea, cole Polytechnique Fdrale de Lausanne (Switzerland) Programme Committee: Eduard Arzt, INMLeibniz Institute for New Materials (Germany); Fred Barlow, Univ. of Arkansas (United States); Joan Bausells, Ctr. Nacional de Microelectr?nica (Spain); Guido Faglia, Univ. degli Studi di Brescia (Italy); Carles Ferrer, Univ. Aut?noma de Barcelona (Spain); Pavel Fiala, Brno Univ. of Technology (Czech Republic); Benno Gerum, University of Applied Sciences of Isny (Germany); Katia M. Grenier, Ctr. National de la Recherche Scientifique (Japan); Moustapha Hafez, Commissariat l'Energie Atomique (France); Klas Hjort, Uppsala Univ. (Sweden); Christian Hoffmann, EPCOS OHG (Austria); Arno Hoogerwerf, Ctr Suisse d'Electronique et de Microtechnique SA (Switzerland); Enrique Iborra, Univ. Politcnica de Madrid (Spain); Gianfranco Innocenti, Ctr. Ricerche Fiat (Italy); Konrad Kapser, Infineon Technologies AG (Germany); Roy Knechtel, X-Fab Semiconductor Foundries AG (Germany); Andreas Kugi, Vienna Univ. of Technology (Austria); Jeong-Bong Lee, The Univ. of Texas at Dallas (United States); Monika Leester-Schaedel, Technische Univ. Braunschweig (Germany); Dean P. Neikirk, The Univ. of Texas at Austin (United States); Joachim Nurnus, Micropelt GmbH (Germany); Sergio P. Pacheco, Freescale Semiconductor, Inc. (United States); Erwin Peiner, Technische Univ. Braunschweig (Germany); Jos L. Snchez de Rojas Aldavero, Universidad de Castilla-La Mancha (Spain); Pietro Siciliano, Consiglio Nazionale delle Ricerche (Italy); Florian Solzbacher, The Univ. of Utah (United States); Christos Tsamis, National Ctr. for Scientific Research Demokritos (Greece); Michael J. Vellekoop, Vienna Univ. of Technology (Austria); J?rgen W?llenstein, Fraunhofer-Institut f?r Physik Messtechnik (Germany); Volker Ziegler, EADS Innovation Works (Germany)
This biannual conference is the fourth in series following its successful launch in 2003. Due to the interdisciplinary spirit of the event a wide range of topics is covered related to the design, fabrication, packaging and system integration of MEMS and NEMS-based sensors and actuators applying smart approaches. Furthermore, basic as well as more application-oriented research topics are addressed, thus stimulating in a cooperative atmosphere the exchange between academia and industry. Topics include, but are not limited to: material research: polymers, piezoelectric materials, nitrides, shape memory alloys, thermoelectric materials, other functional thin film materials, optical thin films, metallic thin films processes and fabrication technologies for MEMS: deposition techniques, lithography, self alignment and masking techniques, etching and ablation techniques functional surfaces: hydrophobic/hydrophilic functionalisation, tribological functions, antiadhesion, biomimetic surfaces, gecko effect modelling and simulation of Microsystems from packaged systems down to device level, CAD tools physical sensors, mechanical sensors, oscillators, tactile sensing optical MEMS (MOEMS), RF MEMS, millimeter/ submillimeter-wave and infrared devices chemical and biosensors, microfluidic devices, lab-on-chip actuators, aeroMEMS, artificial muscles energy harvesting, low power architectures, power management, autonomous sensor nodes calibration, characterisation and testing techniques. reliability, nanotribology, failure analysis, degradation mechanisms, life time prediction system integration, packaging and assembly, electronic integration, substrate technologies, metallization systems, 3D integration techniques, RFID, man-machine interface applications and markets.

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Call for Papers
VLSI Circuits and Systems (EMT102)
Conference Chair: Teresa Riesgo, Univ. Politcnica de Madrid (Spain) Cochairs: Eduardo de la Torre, Univ. Politcnica de Madrid (Spain); Leandro Soares Indrusiak, Technische Univ. Darmstadt (Germany) Programme Committee: Said F. Al-Sarawi, The Univ. of Adelaide (Australia); Sebastin A. Bota, Univ. de les Illes Balears (Spain); Joo M. Castro Ferreira, Univ. do Porto (Portugal); Massimo Conti, Univ. Politecnica delle Marche (Italy); Angel de Castro, Univ. Aut?noma de Madrid (Spain); Marcelino B. Dos Santos, IST-INESC (Portugal); Francisco V. Fernndez, Instituto de Microelectr?nica de Sevilla (Spain); Paul D. Franzon, North Carolina State Univ. (United States); Eby G. Friedman, Univ. of Rochester (United States); Dake Liu, Link?ping Univ. (Sweden); Sebastin L?pez Surez, Univ. de Las Palmas de Gran Canaria (Spain); Antonio L?pezMartn, Univ. Pblica de Navarra (Spain); Celia L?pez-Ongil, Univ. Carlos III de Madrid (Spain); Marie-Minerve Louerat, Univ. Paris VI (France); Gustavo Marrero, Univ. de Las Palmas de Gran Canaria (Spain); Jos S. Matos, Univ. do Porto (Portugal); Salvador Mir, TIMA Lab. (France); Pere L. Miribel-Catal, Univ. de Barcelona (Spain); Flix Moreno, Univ. Politcnica de Madrid (Spain); Antonio Nez Ord?ez, Univ. de Las Palmas de Gran Canaria (Spain); Beln Prez-Verd, Ctr. Nacional de Microelectr?nica (Spain); Juan Jos Rodrguez Andina, Univ. de Vigo (Spain); ngel B. Rodrguez-Vzquez, Anafocus (Spain); Marco D. Samtambroglio, Politecnico di Milano (Italy); Csar Sanz, Univ. Politcnica de Madrid (Spain); Gilles Sassatelli, Lab. d'Informatique de Robotique et de Microelectronique de Montpellier (France); Walter Stechele, Technische Univ. M?nchen (Germany)
This conference will foster cross-fertilization by bringing together researchers from every aspect of the VLSI area, from devices to systems, including design, modeling, test, design methods, etc. Topics include, but are not limited to: VLSI systems and applications transistor circuits techniques; digital and analog signal processors and cores; digital arithmetic; digital filters; memories; low power VLSI; DSPs. Multimedia systems and applications image and video processing; image and video compression and transmission; real-time architectures and processors; multimedia-specific embedded systems; multimedia applications; emerging trends. Circuits and systems for data communications transceiver architectures; switching; backplane design; circuit design for wireless (GSM, CDMA, UMTS, Bluetooth, WLAN, UWB, multiband, TV, radio, satellite); circuits and systems for wired communications (LAN, WAN, Ethernet, xDSL, powerline, cable modem); RF design: antennas, power amplifiers, digital radio techniques, etc. Systems on Chip challenges Reconfigurable Systems, On Chip interconnects, Networks on Chip, Platform based designs Analog circuit design amplifiers; continuous time and discrete-time filters; Nyquist-rate and over-sampled data converters; nonlinear circuits; references; lowpower and low-voltage circuit techniques. Technology directions deep submicron; compound semiconductor technologies and systems; emerging technologies; process integration; chip packaging; mixed systems; sensors and sensor interfaces. Modeling and simulation circuit, timing, logic, functional and system simulation; signal integrity; analog and RF modeling and simulation; mixed-signal and multilevel simulation; device and block modeling; parasitic extraction and analysis; substrate modeling and analysis; interconnect; packaging. CAD tools and design methodologies architectural and logic synthesis; IP generation and verification; analog, RF- and mixed signal design; physical design; verification; hardware design languages; design for manufacturability. Test test generation; testing of cores, SoCs, MCMs, SiPS, boards, heterogeneous systems; analog and mixed-signal test, RF testing; fault modeling and defect analysis; yield analysis; test metrics; on-line testing; design-for-testability; BIST; diagnosis and repair; industrial test case-studies.

Critical Dates
Abstract Due Date: 31 October 2008 Proceedings Manuscript Due Date: 3 April 2009
Please note: Submissions imply the intent of at least one author to register, attend the symposium, present the paper as scheduled (either orally or in poster format), and submit a full-length manuscript for publication in the Proceedings of SPIE. Abstract Text: Please submit a text-only abstract with approximately 500 words (one page). This abstract will be reviewed by the conference organizers and may be included in the abstract digest which will be available onsite.

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Microtechnologies
Nanotechnology (EMT103)
Conference Chair: Achim Wixforth, Univ. of Augsburg (Germany) Cochairs: Axel Lorke, Univ. Duisburg-Essen (Germany); Friedrich C. Simmel, Technische Univ. M?nchen (Germany) Programme Committee: Robert H. Blick, Univ. of Wisconsin, Madison (United States); V. G. Dolgopolov, Institute of Semiconductor Physics (Russian Federation); Klaus Ensslin, ETH Z?rich (Switzerland); Alfred Gold, Ctr. d'Elaboration de Matriaux ed d'Etrudes Structurales (France); Alexander O. Govorov, Ohio Univ. (United States); Kenji Ikushima, The Univ. of Tokyo (Japan); Poul E. Lindelof, Nano-Science Ctr. (Denmark); Joerg K. N. Lindner, Univ. Augsburg (Germany); Harri K. Lipsanen, Helsinki Univ. of Technology (Finland); Paolo Lugli, Technische Univ. M?nchen (Germany); Pierre M. Petroff, Univ. of California/Santa Barbara (United States); Mansour Shayegan, Princeton Univ. (United States); Anatoly Sidorenko, Univ. Chisinau (Moldova); Martin Stutzmann, Technische Univ. M?nchen (Germany); Richard J. Warburton, Heriot-Watt Univ. (United Kingdom); Andreas D. Wieck, Ruhr-Univ. Bochum (Germany)
Nanotechnology has certainly overcome its stages of infancy. Novel fabrication techniques and hybridization of dif fer ent materials r eveal a wealth of new applications or experimental findings that could not be envisioned a few years ago. The Nanotechnology Conference aims towards bringing together research scientists, engineers, and visionaries in this exciting field. Special emphasis is given to technologies and techniques that are briding the different worlds of electronis, mechanics, photonics and biology or soft matter in general. The conference covers, but is not limited to the following areas of research: Nanofabrication novel techniques and technologies, self assembly based fabrication techniques, (bio)template techniques, hybridization of different materials etc. Nanoelectronics electronics exploiting the quantum nature of electronic transport, carbon nanotubes, nanocrystals, molecular electronics, single (few) charge effects, spintronics, plasmonics, magnonics, phononic electronics etc. Nanophotonics few photon sources / detectors, nanoresonators, photonic crystals, waveguides etc. with emphasis on nanotechological fabrication techniques. Nanomechanics NEMS employing nanotubes, nanocrystals, membranes, and artificially fabricated systems. Nano-bio Hybrid Systems sytstems bridging the gap between solid and soft matter, hybridization techniqiues, biological assembly techniques, molecular devices, biomimetics etc.

Bioengineered and Bioinspired Systems (EMT104)
Conference Chair: ngel B. Rodrguez-Vzquez, AnaFocus and Instituto de Microelectr?nica de Sevilla-CNM-CSIC (Spain) Cochairs: Ricardo A. Carmona, Instituto de Microelectr?nica de Sevilla-CNM-CSIC (Spain); Gustavo Lin-Cembrano, Instituto de Microelectr?nica de Sevilla-CNM-CSIC (Spain) Programme Committee: Paolo Arena, Univ. degli Studi di Catania (Italy); Gert Cauwenberghs, Univ. of California, San Diego (United States); Radu Dogaru, Univ. Politehnica Bucuresti (Romania); Antoine Dupret, Univ. Paris-Sud-XI (France); Jos M. Ferrndez, Univ. Politcnica de Cartagena (Spain); Roman Genov, Univ. of Toronto (Canada); Giacomo Indiveri, ETH Z?rich (Switzerland); Pedro Julian, Univ. Nacional del Sur (Argentina); Laura M. Lechuga, CIN2 Research Ctr. on Nanoscience and Nanotechnology (Spain); Maciej J. Ogorzalek; Ram?n Ruiz-Merino, Univ. Politcnica de Cartagena (Spain); Josep Samitier-Marti, Univ. de Barcelona (Spain); Luis Serrano, Univ. Pblica de Navarra (Spain); Bertram Shi, Hong Kong Univ. of Science and Technology (Hong Kong, China); Tor Sverre Lande; Ronald Tetzlaff, Johann Wolfgang GoetheUniv. Frankfurt am Main (Germany); Fernando Vidal-Verd, Univ. de Malaga (Spain); Akos Zarandy, Computer and Automation Research Institute (Hungary)
The development of a human-oriented intelligent environment, and, in particular, of medical micro-implants for patient monitoring, illness control and smart drug delivery, and other aids for citizens with health concerns, relies upon the evolution of micro- and nano-sensors and actuators. In this field, natural systems provide inspirational examples on solving the complex problem of interacting with the real world under serious constraints on power consumption and physical profile. At the same time, the bor der between micr oelectromechanical implantable devices and their living envir onment r emains under continuous r esear ch. A synergetic appr oach covering applied physics, electronics, biochemistry, medicine and neuroscience, is rendering the most promising results in areas such as bioinspir ed sensory pr ocessing, sensor array systems, neural and cognition systems implementation, biomimetics, micr ofluidics, biosensors, chips for genomics and proteomics and smart materials for medical applications. This conference is intended to bring together experts in different disciplines, linked by the strong motivation of contributing to this multidisciplinary scenario. bioinspired VLSI processing architectures VLSI implementations of neuromorphic systems bioinspired sensory-processing-actuating circuits and systems circuits for medical applications implantable electronics biochemical sensors bioMEMS interface circuits for biosensors biomedical instrumentation biosignal processing microfluidics lab-on-chip wireless technology for medical applications telemedicine systems electronic and electromechanical prosthesis smart materials for biomedicine.

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Call for Papers
Photonic Materials, Devices, and Applications (EMT105)
Conference Chair: Ali Serpenguzel, Ko Univ. (Turkey) Cochairs: Gonal Badenes, Institut de Cincies Fot?niques (Spain); Giancarlo C. Righini, CNR (Italy) Programme Committee: Michael J. Adams, Univ. of Essex (United Kingdom); Mario N. Armenise, Politecnico di Bari (Italy); Richard M. De La Rue, Univ. of Glasgow (United Kingdom); Patrice Fron, Ecole Nationale Suprieure des Sciences Appliques et de Technologie (France); Maurizio Ferrari, Consiglio Nazionale delle Ricerche (Italy); Gershon Kurizki, Weizmann Institute of Science (Israel); El-Hang Lee, Inha Univ. (Korea, Republic of); Alfred Leipertz, Friedrich-Alexander-Univ. Erlangen (Germany); Eric D. Mazur, Harvard Univ. (United States); Manuel Nieto-Vesperinas, Consejo Superior de Investigaciones Cientficas (Spain); Alim rmeci, Max-Planck-Institut f?r Physik Komplexer Systeme (Germany); Ekmel Ozbay, Bilkent Univ. (Turkey); Yong-Le Pan, Yale Univ. (United States); Roberto R. Panepucci, Florida International Univ. (United States); Lorenzo Pavesi, Univ. degli Studi di Trento (Italy); Valerio Pruneri, Institut de Cincies Fot?niques (Spain); Manijeh Razeghi, Northwestern Univ. (United States); Ivo Rendina, Consiglio Nazionale delle Ricerche (Italy); Jos R. Salcedo, Multiwave Photonics, S.A. (Portugal); Vahid H. Sandoghdar, Eidgenossische Technische Hochschule (Switzerland); Niyazi S. Sariciftci, Johannes Kepler Univ. Linz (Austria); Gustav Schweiger, Ruhr-Univ. Bochum (Germany)
Photonics is having a tremendous impact on society, spanning a wide range of applications such as telecommunications, diagnostics, sensing, storage, and displays. Recent advances in the development of new photonic materials, devices, systems, and techniques, especially those related to micro- and nanotechnologies suggest that these areas will play an increasingly important role in the future. The aim of this conference will be to bring together research scientists and engineers who work on the different aspects of this fascinating field - and thus to provide an interdisciplinary update and review of innovations in photonic materials, devices, systems, and their applications. The scope of the conference will include micro- and nanotechnological manufacturing advances, as well as work on theoretical and experimental tools that support and enable these innovations. The conference includes, but is not limited to, the following topics: all optical signal processing advanced optical fibers, fiber devices, systems, sensors laser material synthesis and processing, laserinduced fabrication of photonic materials microcavities, microresonators, photonic atoms, and photonic molecules nanophotonics, nanostructured materials and devices, plasmonics organic, semiconductor, and hybrid photonic materials and devices, lasers and LEDs photonic bandgap materials, complex materials, metamaterials photonic devices, systems for telecommunication, sensing, biomedicine and environment quantum photonic devices, quantum information and computing silicon photonics THz photonics, longwave infrared optics.

Critical Dates
Abstract Due Date: 31 October 2008 Proceedings Manuscript Due Date: 3 April 2009
Please note: Submissions imply the intent of at least one author to register, attend the symposium, present the paper as scheduled (either orally or in poster format), and submit a full-length manuscript for publication in the Proceedings of SPIE. Abstract Text: Please submit a text-only abstract with approximately 500 words (one page). This abstract will be reviewed by the conference organizers and may be included in the abstract digest which will be available onsite.

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General Information
Facility/Venue
SPIE Europe Microtechnologies for the New Millennium will take place at the Maritim Hotel & International Congress Centre, Dresden, FR Germany. Dresden is the centre of the German Baroque par excellence. Dresden's highlights include the magnificent palatial buildings around the Theaterplatz and the Br?hl Terraces, and the many art treasures at the state museums. Today, Dresden offers a unique blend of stunning architecture, world-famous art collections and living traditions of both music and the fine arts plus the great natural beauty of the countryside along the Elbe river, dotted with wonderful castles and villas.

Travel
Dresden is serviced by all major airlines on numerous direct flights from across Europe as well as a large number of connecting flights via Frankfurt. Alternatively, Leipzig-Halle Airport offers further connections with transfer via Leipzig city centre. Dresden lies in the zone of moderate climate, intermediate between the marine and continental climates and weather can be quite changeable. The weather in May can be rather diverse with temperature averaging around 14C; however, it can range between 7C and up to over 20C. Germany lies in Central European Time, the same as Spain and France.

Registration Information
All participants, including invited speakers, contributed speakers, session chairs, cochairs and committee members must pay a registration fee. Estimated pre-registration fees for authors and technical participants range from 400 Euros to 600 Euros depending on attendee category and proceedings/CD choice. Estimated student pre-registration fees range from 75 Euros to 100 Euros depending on attendee category and do not include a Proceedings. Final pre-registration fees will be available in February 2009 both online and in the printed advance technical programme. Fees will increase 75 Euros after the preregistration deadlines (20 Euros for students).

Currency
Currency and Credit Cards: The currency unit is the Euro which is subdivided into 100 cents (ct). Delegates may change foreign currency and travellers cheques in banks located in the centre of the city as well as in many exchange bureaus, at the railway station, at the airport or in many other places. International credit cards (VISA, MasterCard, American Express) are accepted in many hotels, restaurants, and cash machines.

Visa Information
Passport and Visa: Nationals of all Western European countries can visit the Federal Republic of Germany without a visa; US, Canadian, and Australian passport holders can stay up to 90 days without a visa. For additional details and specific visa requirements, please contact the German Embassy in your country.

Technical Programme
The comprehensive Advance Technical Programme will be available in February 2009 and will list conferences, paper titles, and authors in order of presentation; an outline of all planned special events; and hotel and registration information. All those who submit an abstract will receive a copy.

Catering
Coffee will be served during the appropriate breaks. Exact times and location will be announced in the Advance Technical Programme.

Hotel/Accommodations
Details concerning hotel accommodations and hotel reservation forms will be included in the Advance Technical Programme.

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Abstract Submission
1. By submitting an abstract, I agree to the following conditions:
An author or coauthor (including keynote, invited, and solicited speakers) will register at the reduced author registration rate, attend the meeting, and make the presentation as scheduled. (Current SPIE Members receive an additional discount on the registration fee.) Authors and coauthors attending the meeting must obtain funding for their registration fees, travel, and accommodations, independent of SPIE, through their sponsoring organizations before submitting abstracts. All clearances, including gover nment and company clearance, have been obtained to present and publish. If you are a DoD contractor, allow at least 60 days for clearance. SPIE is authorized to cir culate your abstract to confer ence committee members for r eview and selection purposes. Accepted abstracts may be published with the printed Final Programs or on a CD-ROM for distribution at the meeting. Please submit only 500-word abstracts that are suitable for publication. Please also submit a 100-word abstract suitable for early release. If accepted, this abstract text will be published prior to the meeting in online or printed programs promoting the conference. A full-length manuscript (8-12 pages) for any accepted oral or poster pr esentation (including keynote, invited, and solicited presentations) will be submitted for publication in the SPIE Digital Library, printed conference Proceedings, and CD-ROM.

Review, Notification, and Programme Placement
To ensure a high-quality conference, all abstracts will be reviewed by the Conference Chair/Editors for technical merit and suitability of content. Conference Chair/ Editors reserve the right to reject for presentation or publication any paper that does not meet content or presentation expectations. Conference Chair/Editors are expected to assess manuscripts for technical merit, suitability of content, and clarity. The process for assessing manuscripts for publication in SPIE proceedings is managed differently by chairs/editors of different conferences. Conference Chair/Editors may require one or more manuscript revisions before approving publication, and reserve the right to reject for publication any paper that does not meet content or quality expectations or manuscript requirements. SPIE's decision on whether to publish a manuscript is final. Applicants will be notified of abstract acceptance and sent manuscript instructions by email no later than 19 October 2008. Final placement in an oral or poster session is subject to the Chairs' discretion. Instructions for oral and poster presentations will be sent to the person marked as Contact Author by email.

Proceedings of SPIE and SPIE Digital Library
Full-manuscripts will be Chair/Editor-approved and published in the Proceedings of SPIE and in SPIE Digital Library. Manuscript instructions will be emailed to the person marked as contact author for the paper and are also available from the "Information for Authors" link on the conference website. Authors must be authorized to transfer copyright of the manuscript to SPIE, or provide a suitable publication license. Authors reserve the right to expand and revise the manuscript for future publication. Only papers presented at the conference will be published in the conference Proceedings and SPIE Digital Library. Published papers are indexed in leading scientific databases including INSPEC, Ei Compendex, Chemical Abstracts, International Aerospace Abstracts, ISI Index to Scientific and Technical Proceedings and NASA Astrophysical Data System, and are searchable in the SPIE Digital Library. Full manuscripts are available to all SPIE Digital Library subscribers.

2. Prepare to submit
Have all contact information (full names, affiliations, addresses, phone numbers, and emails) for your coauthors ready. Only original material should be submitted. Abstracts should contain enough detail to clearly convey the approach and the results of the research. Commercial papers, papers with no new research/ development content, and papers where supporting data or a technical description cannot be given for proprietary reasons should not be submitted, and will not be accepted for presentation in this conference.

3. Submit your abstract online
Browse to locate the conference to which you are submitting at:

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Click on "Submit an abstract." If you have a MySPIE account, sign in using your username and password. First-time users of MySPIE can create a new account by clicking on the Create an Account link.

Critical Dates
Abstract Due Date: 31 October 2008 Proceedings Manuscript Due Date: 3 April 2009
Please note: Submissions imply the intent of at least one author to register, attend the symposium, present the paper as scheduled (either orally or in poster format), and submit a full-length manuscript for publication in the Proceedings of SPIE. Abstract Text: Please submit a text-only abstract with approximately 500 words (one page). This abstract will be reviewed by the conference organizers and may be included in the abstract digest which will be available onsite.

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Call for Papers
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Conferences: 46 May 2009 Maritim Hotel Dresden, Germany

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